• About Us
    • Company Information
    • Corporate Culture
    • Senior Leadership Team
    • Worldwide Locations
    • News Center
    • Events Information
    • Social Responsibility
    • Green Manufacturing
    • Conflict-Free Minerals Policy
    • Join JCET
    • Contact Us
  • Technology
    • 2.5D/3D Integration
    • Wafer Level & Fan Out Packaging
    • System-in-Package
    • Flip Chip Packaging
    • Wirebond Packaging
    • MEMS and Sensors Packaging
  • Services
    • Turnkey Services
    • Design & Characterization
    • Wafer Bumping
    • Packaging Services
    • Test Services
    • Reliability Tests and Failure Analysis
  • Applications
    • Automotive
    • Communications
    • Computing
    • Storage
  • Investor Relations
    • Board of Directors
    • Financial Reports
中文
News Center
About News

News

2022 2021 2020 2019 and before
  • 2022-03-29 18:35

    JCET Donates Funds to Support Rural Education Development

    More
  • 2022-03-29 18:35

    JCET Unveils New Logo Representing the Company’s Continued Evolution

    More
  • 2022-03-29 18:35

    JCET Continues to Expand Its Global Footprint at SEMICON Europa in Germany

    More
  • 2022-03-29 18:35

    JCET Expands Production Capacity in Suqian to Better Serve Global Customer Needs

    More
  • 2022-03-29 18:35

    JCET Continues Strong 2021 with Another Record High Performance in Q3

    More
  • 2022-03-29 18:35

    JCET 1H 2021 Net Profit Jumps 261%, Earnings Surpass FY 2020 Mark

    More
  • 2022-03-29 18:35

    JCET Group Releases XDFOI Solutions Enabling Flexible Heterogeneous Integration

    More
  • 2022-03-29 18:35

    JCET Net Profit Projected to More than Double According to 2021 Half-Year Earnings Pre Announcement

    More
  • << 首页
  • 上一页
  • 1
  • 2
  • 3
  • 下一页
  • 末页 >>
  • 友情链接:

This website uses cookies to improve user experience. By using our website you consent to all cookies in accordance with our Cookie Policy.

Accept